Agenda

Ensuring Accurate Material Properties for Simulation with Digital Image Correlation

30 jan. 2020 17:00 — 18:00 Add this to Calendar

Coefficient of Thermal Expansion (CTE) is one the most important factors affecting solder fatigue. Thus knowing the accurate CTE for your materials is essential when designing electronics and selecting initial parts. With increasingly complex materials and architectures being inserted into complicated simulations, Digital Image Correlation (DIC) can help you to...