Advancement of Industry, Science and Technology

Problem

Because of the close packing of 3‐D ICs, thermal issues are a top priority -especially at TSVs where electrical currents are concentrated and holes in the silicon may be mechanically stressed by thermal gradients and structural loading.

Solution

To identify potential problems early in design, an analysis can be performed using a combination of tools: GemPackage™ for model construction, ANSYS SIwave software for DC analysis and ANSYS Icepak technology for thermal analysis.

Result

Simulation showed that the bottom chip was hotter than the upper chip, since heat flows downward.

 

The process could be extended to easily study signal integrity/power integrity (SI/PI) issues because the same ANF file can be entered into ANSYS SI/PI tools, including ANSYS SIwave, TPA, HFSS and Q3D Extractor.